Eagle Circuits Joins Effort to Transform U.S. Electronics Manufacturing

The company will build first assemblies to validate the Occam Process

September 02, 2024 - El Dorado Hills, CA - As part of an effort to demonstrate Occam’s superiority over conventional assemblies, Eagle Circuits, Dallas TX, has been selected to build the first set of Occam test assemblies. These assemblies will be subjected to a battery of reliability and environmental tests in order to establish Occam’s viability and superiority over incumbent methodologies. This project is being funded by the DOD Executive Agent in cooperation with the Naval Surface Warfare Center, Crane.

“Occam component assemblies provide a giant leap forward for U.S. manufacturing,” said Ray Rasmussen, Occam managing partner. “Using existing equipment, fabricators and their EMS partners are able to construct Occam assemblies today. Once companies give Occam a spin, they will begin to see the possibilities.”  Eagle CEO, Nilesh Naik added, “in going through this process we began to see, what Ray calls, the Occam Opportunity for Eagle and the industry. The possibilities are almost endless. Instead of driving the industry to more and more complex configurations, Occam simplifies the process, allowing us to do much more with a lot less.”

Occam’s solderless methodology lowers cost while greatly improving reliability. Occam addresses many of the stated concerns from DOD regarding the reliability of electronic assemblies as well as a world-leading path forward for the domestic industry. Occam is home-grown, U.S. based, highly reliable, with thermal management, EMI/ESD, security built in. Occam greatly reduces the need for UHDI giving the industry a pathway to achieve world leading performance without the complexity.

About Eagle Circuits

Eagle Circuits is a quick turn prototype facility based in Dallas, Texas, integrated inside an 18,000 square foot facility, offering full turnkey pub fabrication and assembly solutions within 5 days.

As a prototype facility, the company’s quick turn philosophy fully supports the needs of the product development community. For more information, please visit our website: http://www.eaglecircuits.com/

About The Occam Group

The Occam Group (TOG) is bringing its game-changing solderless assembly technology to industry in order to revolutionize component assemblies, greatly improve reliability and performance, while significantly reducing product size and cost.

This group’s sole purpose is to find committed partners desiring to adopt and integrate the Occam Process into their businesses. 

Joe Fjelstad is the inventor of the Occam Process and has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. One of his patents for a low profile bottom leaded IC package presaged the QFN citing a key feature that makes these ubiquitous IC packages reliable and  is today cited in more than 550 other patents.  He is an internationally recognized book and column author, electronics interconnection technology expert, inventor and lecturer in the field of interconnection technology and is as well a veteran of several startup companies beyond Verdant Electronics, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera  (now the public company, ADEIA ) where he was the first appointed corporate  fellow in 1998

Ray Rasmussen is a widely respected veteran PCB industry watcher, reporter and analyst and trusted source and sounding board for numerous industry executives. He was co-founder, editor and publisher of CircuiTree magazine, publisher of SMT Magazine and iConnect007. 

Contact us at: The Occam Group or email us at: ray@theoccamgroup.com

916-337-4402

About The Occam Process

Occam’s approach to circuit assembly and circuitization are unique. Occam reimagines and redefines how component interconnections are designed, assembled and circuitized. Inherently, 

Occam solderless assemblies offer greater product reliability, fewer potential process errors, and a smaller product footprint while removing a significant number of process steps.

With Occam, components are first attached to a “component board” and tested before encapsulation and circuitization, ensuring that all Occam assemblies are known good at the outset. There are several methods for adding component connections including traditional plating techniques, additive printed circuits (printed electronics) among others.

The Occam Process does not require high temperature assembly, therefore reliability issues related to high temperatures are eliminated.